blu G73 vs hotwav T7S

En bref

Marque: BLU; Hotwav
Date de sortie: août 2023, il y a 2 ans et 9 mois; janvier 2025, il y a 1 ans et 4 mois
AnTuTu: 211.000 Antutu v9 Overall performance better than 56% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Taille: 6.8"; 6.52"
Résolution: 720 x 1600 px HD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Densité: 258 ppi Medium Density; 407 ppi Very high density
Rapport d’aspect: 20:9; 21:9
Fonctions: Water Drop Notch, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Chipset: Unisoc Tiger T606; MediaTek MT8788V
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 12 nm
Fréquence: 1.6 GHz; 2 GHz
GPU: ARM Mali-G57; Mali-G72 MP3
RAM: 4 GB; 4 GB
Type de RAM: LPDDR4 RAM; LPDDR4X RAM
64 bits: Yes; Yes

Résolution: 50 Mpx; 21 Mpx
Ouverture: Unknow; Unknow
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Triple camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Capteur: —; Sony Exmor

Capacité: 128 GB; 128 GB
Emplacement SD: Yes , Independent SD slot; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 78.9 mm 168.3 mm 9.9 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Poids: 209 g; 310 g
Matériaux: Plastic; Rugged Smartphone, Plastic , Faux leather
Couleurs: Black White Green Violet Pearl; Black Green
Surface utile: 84 %; 71 %
Résistance eau/poussière: —; IP68, IP69 , MIL-STD-810H
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Single SIM (Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B12 (700), B17 (700), B28b (700), B28a (700), B66 (1700/2100), B71 (600); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)