coolpad C16 vs Cubot KingKong Power 3

En bref

Marque: Coolpad; Cubot
Date de sortie: septembre 2024, il y a 1 ans et 8 mois; octobre 2024, il y a 1 ans et 7 mois
AnTuTu: 218.000 Antutu v10 Overall performance better than 56% of devices; 411.163 Antutu v10 Overall performance better than 68% of devices

Taille: 6.75"; 6.72"
Résolution: 720 x 1600 px HD+; 1080 x 2408 px FHD+
Type: LCD IPS; LCD IPS
Densité: 260 ppi Medium Density; 401 ppi Very high density
Rapport d’aspect: 20:9; 20:9
Fonctions: Water Drop Notch, Refresh rate 90 Hz, Touch sampling rate 180 Hz, Brightnes 400 cd/m² (typ), 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell

Chipset: Unisoc Tiger T606; MediaTek Helio G99 (MT6789)
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 6 nm
Fréquence: 1.6 GHz; 2.2 GHz
GPU: ARM Mali-G57; Mali-G57 MC2
RAM: 4 GB; 6 GB
Type de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Résolution: 50 Mpx; 100 Mpx
Ouverture: ƒ/ 1.8; Unknow
Flash: Dual LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer
Taille de pixel: —; 0.80 µm

Capacité: 128 GB; 256 GB
Type: eMMC 5.1 Storage; —
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 77.9 mm 167.9 mm 8.7 mm Print 3D Model; 82.7 mm 165.3 mm 20.0 mm Print 3D Model
Poids: 215 g; 425 g
Matériaux: Plastic; Rugged Smartphone, Metal
Couleurs: Black Blue Green; Black
Surface utile: 84 %; 79 %
Résistance eau/poussière: —; IP68, IP69
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 14 Upside-down cake CoolOS (Android 14); Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.2
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)