coolpad X100 vs Cubot KingKong 11

En bref

Marque: Coolpad; Cubot
Date de sortie: mai 2025, il y a 1 ans; juillet 2025, il y a 10 mois
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 470.000 Antutu v10 Overall performance better than 72% of devices

Taille: 6.78"; 6.72"
Résolution: 1080 x 2460 px FHD+; 1080 x 2400 px FHD+
Type: LCD IPS; LCD IPS
Densité: 396 ppi High Density; 400 ppi Very high density
Rapport d’aspect: 20:9; 20:9
Fonctions: Hole-punch Notch, Refresh rate 120 Hz, Brightnes 450 cd/m² (typ), DCI-P3, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek Dimensity 7025
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2x2.5 GHz ARM Cortex A78+6x 2.0 GHz ARM Cortex A55
Type de CPU: Octa-Core; Octa-Core
Gravure: 6 nm; 6 nm
Fréquence: 2.2 GHz; 2.5 GHz
GPU: Mali-G57 MC2; IMG BXM-8-256
RAM: 8 GB; 16 GB
Type de RAM: LPDDR4X RAM; RAM LPDDR5
64 bits: Yes; Yes

Résolution: 108 Mpx; 108 Mpx
Ouverture: ƒ/ 1.69; ƒ/ 1.89
Flash: LED; Dual LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer, Night Vision
Capteur: —; Samsung HM6
Taille de pixel: —; 0.61 µm
Taille du capteur: —; 1/1.67"

Capacité: 256 GB; 256 GB
Type: UFS Storage 2.2; UFS Storage 3.1
Emplacement SD: Yes , Independent SD slot; Yes , Slot for SD or second SIM card

Dimensions: 76.3 mm 169.0 mm 8.8 mm Print 3D Model; 84.1 mm 176.0 mm 18.7 mm Print 3D Model
Poids: 213 g; 388 g
Matériaux: Polycarbonate; TPU , Rugged Smartphone
Couleurs: Black Blue Silver Pink; Black
Résistance eau/poussière: IP54; IP68, IP69 , MIL-STD-810H
Surface utile: 84 %; 73 %
Résistance aux chutes: —; Class A B C D E 90 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 6.0; Bluetooth 5.1 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO
USB: USB Type-C; —
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n25 (1900), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n66 (1700), n77 (3700), n78 (3500)