coolpad X100 vs hotwav T7

En bref

Marque: Coolpad; Hotwav
Date de sortie: mai 2025, il y a 1 ans et 1 mois; juillet 2024, il y a 1 ans et 11 mois
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Taille: 6.78"; 6.6"
Résolution: 1080 x 2460 px FHD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Densité: 396 ppi High Density; 407 ppi Very high density
Rapport d’aspect: 20:9; 21:9
Fonctions: Hole-punch Notch, Refresh rate 120 Hz, Brightnes 450 cd/m² (typ), DCI-P3, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek MT8788V
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 6 nm; 12 nm
Fréquence: 2.2 GHz; 2 GHz
GPU: Mali-G57 MC2; Mali-G72 MP3
RAM: 8 GB; 4 GB
Type de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Résolution: 108 Mpx; 21 Mpx
Ouverture: ƒ/ 1.69; Unknow
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Capteur: —; Sony Exmor

Capacité: 256 GB; 128 GB
Type: UFS Storage 2.2; eMMC 5.1 Storage
Emplacement SD: Yes , Independent SD slot; Yes , Slot for SD or second SIM card

Dimensions: 76.3 mm 169.0 mm 8.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Poids: 213 g; 292 g
Matériaux: Polycarbonate; Rugged Smartphone, Plastic , Faux leather
Couleurs: Black Blue Silver Pink; Black Orange
Résistance eau/poussière: IP54; IP68, IP69 , MIL-STD-810H
Surface utile: 84 %; 71 %

Système d’exploitation: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 6.0; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)