coolpad X100 vs iiif150 B3C

En bref

Marque: Coolpad; iiiF150
Date de sortie: mai 2025, il y a 1 ans; avril 2025, il y a 1 ans et 1 mois
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 251.000 Antutu v10 Overall performance better than 59% of devices

Taille: 6.78"; 6.6"
Résolution: 1080 x 2460 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Densité: 396 ppi High Density; 266 ppi Medium Density
Rapport d’aspect: 20:9; 20:9
Fonctions: Hole-punch Notch, Refresh rate 120 Hz, Brightnes 450 cd/m² (typ), DCI-P3, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Color LED Notifications, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); Unisoc UMS9230
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2 x 1.8 GHz & 6 x 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 6 nm; 12 nm
Fréquence: 2.2 GHz; 1.8 GHz
GPU: Mali-G57 MC2; Mali G57 MP1
RAM: 8 GB; 4 GB
Type de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Résolution: 108 Mpx; 50 Mpx
Ouverture: ƒ/ 1.69; Unknow
Flash: LED; Triple LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 256 GB
Type: UFS Storage 2.2; UFS Storage 2.2
Emplacement SD: Yes , Independent SD slot; Yes , Slot for SD or second SIM card

Dimensions: 76.3 mm 169.0 mm 8.8 mm Print 3D Model; 79.6 mm 168.8 mm 15.8 mm Print 3D Model
Poids: 213 g; 336 g
Matériaux: Polycarbonate; TPU , Rugged Smartphone, Polycarbonate , Metal
Couleurs: Black Blue Silver Pink; Black Gray
Résistance eau/poussière: IP54; IP68, IP69 , MIL-STD-810H
Surface utile: 84 %; 78 %
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 6.0; Bluetooth 5.0
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)