Cubot KingKong 8 vs hisense A9 Pro

En bref

Marque: Cubot; HiSense
Date de sortie: octobre 2023, il y a 2 ans et 7 mois; mars 2023, il y a 3 ans et 2 mois
AnTuTu: 224.235 Antutu v9 Overall performance better than 56% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Taille: 6.53"; 6.1"
Résolution: 720 x 1612 px HD+; 824 x 1648 px FHD
Type: LCD IPS; eInk E INK Carta 1200
Densité: 401 ppi Very high density; 302 ppi High Density
Rapport d’aspect: 20:9; 18:9
Fonctions: Hole-punch Notch, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Water Drop Notch, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Qualcomm Snapdragon 662
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 11 nm
Fréquence: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Qualcomm Adreno 610
RAM: 6 GB; 8 GB
Type de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Résolution: 48 Mpx; 13 Mpx
Ouverture: Unknow; Unknow
Taille de pixel: 0.80 µm; —
Flash: Triple LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 256 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 80.2 mm 169.9 mm 20.0 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Poids: 382 g; 183 g
Matériaux: Rugged Smartphone, Metal; Plastic
Couleurs: Black Red Green; Black
Résistance eau/poussière: IP68, IP69; —
Résistance aux chutes: Class A B C D E 270 drops without defects; —
Réparabilité: Class A B C D E; —
Surface utile: 76 %; 76 %

Système d’exploitation: Android 13 Tiramisu Android 13; Android 12 Snow Cone Android 12
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.1
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)