Cubot Kingkong Mini 4 vs Ulefone Armor X12

En bref

Marque: Cubot; Ulefone
Date de sortie: novembre 2025, il y a 7 mois; juillet 2023, il y a 2 ans et 11 mois
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 92.000 Antutu v9 Overall performance better than 50% of devices

Taille: 4.7"; 5.45"
Résolution: 720 x 1600 px HD+; 720 x 1440 px HD+
Type: LCD IPS; LCD IPS
Densité: 373 ppi High Density; 250 ppi Medium Density
Rapport d’aspect: 20:9; 18:9
Fonctions: Hole-punch Notch, Glove touch support, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch; Without Notch, Capacitive, Multi-touch, Frameless, Oleophobic coating

Chipset: Unisoc Tiger T616; MediaTek Helio A22 (MT6761)
CPU: 2 x ARM Cortex A75 2.0Ghz + 6 x ARM Cortex A55 1.8Ghz; 4x Cortex A53 2.0 GHz
Type de CPU: Octa-Core; Quad-Core
Gravure: 12 nm; 12 nm
Fréquence: 2 GHz; 2 GHz
GPU: Mali-G57 MP1; IMG PowerVR GE-class GPU
RAM: 6 GB; 3 GB
Type de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Résolution: 48 Mpx; 13 Mpx
Ouverture: ƒ/ 1.8; ƒ/ 2.2
Flash: LED; Dual LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Capteur: —; Sony IMX214 Exmor RS
Taille de pixel: —; 1.12 µm
Taille du capteur: —; 1/3.06"

Capacité: 128 GB; 32 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot
Type: —; eMMC 5.1 Storage

Dimensions: 61.0 mm 128.7 mm 16.8 mm Print 3D Model; 76.8 mm 157.2 mm 14.3 mm Print 3D Model
Poids: 192 g; 257 g
Matériaux: Rugged Smartphone, Polycarbonate; Rugged Smartphone, Polycarbonate
Couleurs: Black Red Green Orange; Black Green Orange
Résistance eau/poussière: IP68, MIL-STD-810G , IP69; IP68, IP69 , MIL-STD-810H
Résistance aux chutes: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Réparabilité: Class A B C D E; Class A B C D E
Surface utile: 68 %; 88 %

Système d’exploitation: Android 15 Android 15; Android 13 Tiramisu Android 13 Go Edition
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28a (700)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)