hisense A9 Pro vs hmd ARC

En bref

Marque: HiSense; HMD
Date de sortie: mars 2023, il y a 3 ans et 3 mois; décembre 2024, il y a 1 ans et 6 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 154.110 Antutu v10 Overall performance better than 54% of devices

Taille: 6.1"; 6.52"
Résolution: 824 x 1648 px FHD; 576 x 1280 px LowRes
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 215 ppi Medium Density
Rapport d’aspect: 18:9; 20:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), 70% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Spreadtrum Unisoc SC9863A
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 28 nm
Fréquence: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; PowerVR GE8322
RAM: 8 GB; 4 GB
64 bits: Yes; Yes

Résolution: 13 Mpx; 13 Mpx
Ouverture: Unknow; ƒ/ 2.0
Flash: LED; Dual LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 64 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.9 mm 166.4 mm 9.0 mm Print 3D Model
Poids: 183 g; 185 g
Matériaux: Plastic; Plastic
Couleurs: Black; Black
Surface utile: 76 %; 80 %
Résistance eau/poussière: —; IP54
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services
Mises à jour: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)