hisense A9 Pro vs hmd Pulse

En bref

Marque: HiSense; HMD
Date de sortie: mars 2023, il y a 3 ans et 3 mois; avril 2024, il y a 2 ans et 2 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 223.000 Antutu v10 Overall performance better than 56% of devices
Prix de lancement: —; € 139.00 ($ 162.86)

Taille: 6.1"; 6.56"
Résolution: 824 x 1648 px FHD; 720 x 1612 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 265 ppi Medium Density
Rapport d’aspect: 18:9; 20:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Brightnes 480 cd/m² (typ), 70% NTSC, NTSC, Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T606
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 12 nm
Fréquence: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57
RAM: 8 GB; 4 GB
64 bits: Yes; Yes
Type de RAM: —; LPDDR4X RAM

Résolution: 13 Mpx; 13 Mpx
Ouverture: Unknow; Unknow
Flash: LED; Dual LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 64 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 75.0 mm 163.2 mm 8.5 mm Print 3D Model
Poids: 183 g; 187 g
Matériaux: Plastic; Plastic
Couleurs: Black; Black Blue Pink
Surface utile: 76 %; 84 %
Résistance eau/poussière: —; IP52
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services
Mises à jour: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; —
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28a (700), B38 (TDD 2600), B40 (TDD 2300)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)