hisense A9 Pro vs Honor X7c

En bref

Marque: HiSense; Honor
Date de sortie: mars 2023, il y a 3 ans et 3 mois; octobre 2024, il y a 1 ans et 8 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 321.000 Antutu v10 Overall performance better than 62% of devices

Taille: 6.1"; 6.77"
Résolution: 824 x 1648 px FHD; 720 x 1610 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 261 ppi Medium Density
Rapport d’aspect: 18:9; 20:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, SGS Certified, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Qualcomm Snapdragon 685 (SM6225)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x2.8 GHz Cortex A73 + 4x1.9GHz Cortex A53
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 6 nm
Fréquence: 2 GHz; 2.8 GHz
GPU: Qualcomm Adreno 610; Adreno 610
RAM: 8 GB; 8 GB
64 bits: Yes; Yes
Type de RAM: —; LPDDR4X RAM

Résolution: 13 Mpx; 108 Mpx
Ouverture: Unknow; ƒ/ 1.8
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Taille de pixel: —; 0.64 µm

Capacité: 256 GB; 256 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.8 mm 166.9 mm 8.1 mm Print 3D Model
Poids: 183 g; 196 g
Matériaux: Plastic; Plastic
Couleurs: Black; Black White Green
Surface utile: 76 %; 85 %
Résistance eau/poussière: —; IP64

Système d’exploitation: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services
Mises à jour: —; OS updates: 2 years, Security updates: 3 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax)
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)