hisense A9 Pro vs hotwav Note 16 Pro

En bref

Marque: HiSense; Hotwav
Date de sortie: mars 2023, il y a 3 ans et 3 mois; septembre 2025, il y a 9 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 235.000 Antutu v10 Overall performance better than 57% of devices

Taille: 6.1"; 6.9"
Résolution: 824 x 1648 px FHD; 720 x 1640 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 260 ppi Medium Density
Rapport d’aspect: 18:9; 20:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 450 cd/m² (typ), Max brightness HBM - 500 cd/m², 2.5D curved glass screen, Panda glass, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T606
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 12 nm
Fréquence: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57
RAM: 8 GB; 4 GB
64 bits: Yes; Yes
Type de RAM: —; LPDDR4X RAM

Résolution: 13 Mpx; 13 Mpx
Ouverture: Unknow; ƒ/ 1.8
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 128 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 78.3 mm 171.8 mm 8.2 mm Print 3D Model
Poids: 183 g; 208 g
Matériaux: Plastic; Plastic
Couleurs: Black; Black Pink Gray
Surface utile: 76 %; 82 %
Résistance aux chutes: —; Class A B C D E 52 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)