hisense A9 Pro vs HTC Desire 22 Pro

En bref

Marque: HiSense; HTC
Date de sortie: mars 2023, il y a 3 ans et 3 mois; juin 2022, il y a 4 ans
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 357.950 Antutu v9 Overall performance better than 64% of devices

Taille: 6.1"; 6.6"
Résolution: 824 x 1648 px FHD; 1080 x 2412 px FHD+
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 400 ppi Very high density
Rapport d’aspect: 18:9; 20:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 120 Hz, Scratch resistant, Corning Gorilla Glass, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Qualcomm Snapdragon 695 (SM6375)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2 GHz Kryo 660 Gold +6x1.7 GHz Kryo 660 Silver
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 6 nm
Fréquence: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Qualcomm Adreno 619
RAM: 8 GB; 8 GB
64 bits: Yes; Yes
Type de RAM: —; LPDDR4X RAM

Résolution: 13 Mpx; 64 Mpx
Ouverture: Unknow; ƒ/ 1.75
Flash: LED; Dual LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 128 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.9 mm 166.3 mm 9.4 mm Print 3D Model
Poids: 183 g; 206 g
Matériaux: Plastic; Plastic
Couleurs: Black; Black Rose Gold
Surface utile: 76 %; 82 %
Résistance eau/poussière: —; IP67

Système d’exploitation: Android 12 Snow Cone Android 12; Android 12 Snow Cone Android 12
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n7 (2600), n20 (800), n28b (700), n28a (700), n41 (2500), n78 (3500)