hisense A9 Pro vs iiif150 B2

En bref

Marque: HiSense; iiiF150
Date de sortie: mars 2023, il y a 3 ans et 2 mois; octobre 2023, il y a 2 ans et 7 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 251.400 Antutu v10 Overall performance better than 59% of devices

Taille: 6.1"; 6.5"
Résolution: 824 x 1648 px FHD; 1080 x 2400 px FHD+
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 405 ppi Very high density
Rapport d’aspect: 18:9; 20:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, LED Notifications, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T606
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 12 nm
Fréquence: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57
RAM: 8 GB; 6 GB
64 bits: Yes; Yes

Résolution: 13 Mpx; 48 Mpx
Ouverture: Unknow; ƒ/ 1.8
Flash: LED; Triple LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Vision
Capteur: —; Samsung S5KGM2
Taille de pixel: —; 0.80 µm
Taille du capteur: —; 1/2"

Capacité: 256 GB; 256 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.1

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 81.6 mm 171.0 mm 16.7 mm Print 3D Model
Poids: 183 g; 356 g
Matériaux: Plastic; Rugged Smartphone, Polycarbonate , Titanium
Couleurs: Black; Black Orange
Surface utile: 76 %; 73 %
Résistance eau/poussière: —; IP68, MIL-STD-810G , IP69

Système d’exploitation: Android 12 Snow Cone Android 12; Android 11 Red Velvet Cake Android 11
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)