hisense A9 Pro vs Ulefone Armor 21

En bref

Marque: HiSense; Ulefone
Date de sortie: mars 2023, il y a 3 ans et 3 mois; mai 2023, il y a 3 ans et 1 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 411.900 Antutu v10 Overall performance better than 68% of devices

Taille: 6.1"; 6.58"
Résolution: 824 x 1648 px FHD; 1080 x 2408 px FHD+
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 367 ppi High Density
Rapport d’aspect: 18:9; 20:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 120 Hz, Touch sampling rate 240 Hz, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch, Oleophobic coating

Chipset: Qualcomm Snapdragon 662; MediaTek Helio G99 (MT6789)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 6 nm
Fréquence: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MC2
RAM: 8 GB; 8 GB
64 bits: Yes; Yes
Type de RAM: —; LPDDR4X RAM

Résolution: 13 Mpx; 64 Mpx
Ouverture: Unknow; ƒ/ 1.9
Flash: LED; Dual LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Capteur: —; Sony IMX686 Exmor RS
Taille de pixel: —; 0.80 µm
Taille du capteur: —; 1/1.7"

Capacité: 256 GB; 256 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot
Type: —; UFS Storage 2.1

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 81.6 mm 176.0 mm 18.1 mm Print 3D Model
Poids: 183 g; 400 g
Matériaux: Plastic; Rugged Smartphone, Polycarbonate
Couleurs: Black; Black
Surface utile: 76 %; 77 %
Résistance eau/poussière: —; IP68, IP69 , MIL-STD-810H
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), B2 (1900), B3 (1800), B5 (850), B8 (900)