hisense A9 Pro vs Xiaomi Redmi 13X

En bref

Marque: HiSense; Xiaomi
Date de sortie: mars 2023, il y a 3 ans et 3 mois; mars 2025, il y a 1 ans et 3 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Taille: 6.1"; 6.79"
Résolution: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Type: eInk E INK Carta 1200; LTPS LCD
Densité: 302 ppi High Density; 388 ppi High Density
Rapport d’aspect: 18:9; 19.5:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Max brightness HBM - 550 cd/m², Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; MediaTek Helio G91
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 12 nm
Fréquence: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G52 MC2 850MHz
RAM: 8 GB; 6 GB
64 bits: Yes; Yes

Résolution: 13 Mpx; 108 Mpx
Ouverture: Unknow; ƒ/ 1.8
Flash: LED; Quad LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 128 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.3 mm 168.6 mm 8.3 mm Print 3D Model
Poids: 183 g; 205 g
Matériaux: Plastic; Plastic , P2i Nano coating , Splash resistant design
Couleurs: Black; Black Cyan
Surface utile: 76 %; 94 %

Système d’exploitation: Android 12 Snow Cone Android 12; Android 14 Upside-down cake HyperOS (Android 14)
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.3 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)