hisense E60 Lite vs Xiaomi Redmi 13

En bref

Marque: HiSense; Xiaomi
Date de sortie: avril 2022, il y a 4 ans et 2 mois; mai 2024, il y a 2 ans et 1 mois
AnTuTu: 121.300 Antutu v9 Overall performance better than 52% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Taille: 6.52"; 6.79"
Résolution: 720 x 1600 px HD+; 1080 x 2400 px FHD+
Type: LCD IPS; LTPS LCD
Densité: 269 ppi Medium Density; 388 ppi High Density
Rapport d’aspect: 21:9; 19.5:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Chipset: Spreadtrum Unisoc SC9863A; MediaTek Helio G91
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 28 nm; 12 nm
Fréquence: 1.6 GHz; 2 GHz
GPU: PowerVR GE8322; Arm Mali-G52 MC2 850MHz
RAM: 2 GB; 6 GB
64 bits: Yes; Yes

Résolution: 13 Mpx; 108 Mpx
Ouverture: Unknow; ƒ/ 1.8
Flash: Dual LED; Quad LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Digital zoom, Triple camera, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 64 GB; 128 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 76.7 mm 166.0 mm 9.7 mm Print 3D Model; 76.3 mm 168.6 mm 8.2 mm Print 3D Model
Poids: 199 g; 198 g
Matériaux: Plastic; Plastic , P2i Nano coating , Splash resistant design
Couleurs: Blue Gray; Black Pink Cyan
Surface utile: 80 %; 94 %

Système d’exploitation: Android 11 Red Velvet Cake Android 11 Go edition; Android 14 Upside-down cake HyperOS (Android 14)
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.4 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11b , 802.11g , 802.11n , 802.11n 5GHz; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B12 (700), B26 (850), B28b (700), B28a (700); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)