hmd ARC vs iiif150 B3C

En bref

Marque: HMD; iiiF150
Date de sortie: décembre 2024, il y a 1 ans et 6 mois; avril 2025, il y a 1 ans et 2 mois
AnTuTu: 154.110 Antutu v10 Overall performance better than 54% of devices; 251.000 Antutu v10 Overall performance better than 59% of devices

Taille: 6.52"; 6.6"
Résolution: 576 x 1280 px LowRes; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Densité: 215 ppi Medium Density; 266 ppi Medium Density
Rapport d’aspect: 20:9; 20:9
Fonctions: Water Drop Notch, Brightnes 400 cd/m² (typ), 70% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Color LED Notifications, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Spreadtrum Unisoc SC9863A; Unisoc UMS9230
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 2 x 1.8 GHz & 6 x 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 28 nm; 12 nm
Fréquence: 1.6 GHz; 1.8 GHz
GPU: PowerVR GE8322; Mali G57 MP1
RAM: 4 GB; 4 GB
64 bits: Yes; Yes
Type de RAM: —; LPDDR4X RAM

Résolution: 13 Mpx; 50 Mpx
Ouverture: ƒ/ 2.0; Unknow
Flash: Dual LED; Triple LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 64 GB; 256 GB
Emplacement SD: Yes , Independent SD slot; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 76.9 mm 166.4 mm 9.0 mm Print 3D Model; 79.6 mm 168.8 mm 15.8 mm Print 3D Model
Poids: 185 g; 336 g
Matériaux: Plastic; TPU , Rugged Smartphone, Polycarbonate , Metal
Couleurs: Black; Black Gray
Résistance eau/poussière: IP54; IP68, IP69 , MIL-STD-810H
Résistance aux chutes: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Réparabilité: Class A B C D E; Class A B C D E
Surface utile: 80 %; 78 %

Système d’exploitation: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Mises à jour: OS updates: 5 years; —
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11b , 802.11g , 802.11n; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)