Honor X5 Plus vs Xiaomi Redmi 15 4G

En bref

Marque: Honor; Xiaomi
Date de sortie: octobre 2023, il y a 2 ans et 8 mois; août 2025, il y a 10 mois
AnTuTu: 127.000 Antutu v9 Overall performance better than 53% of devices; 338.000 Antutu v10 Overall performance better than 63% of devices

Taille: 6.56"; 6.9"
Résolution: 720 x 1612 px HD+; 1080 x 2340 px FHD+
Type: LCD IPS; LCD IPS
Densité: 269 ppi Medium Density; 374 ppi High Density
Rapport d’aspect: 20:9; 20:9
Fonctions: Water Drop Notch, Refresh rate 90 Hz, TÜV Rheinland Eye Comfort Certification, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Hole-punch Notch, TUV Rheinland Low Blue Light, TÜV Rheinland Flicker-free Certified, Refresh rate 144 Hz, Brightnes 700 cd/m² (typ), TÜV Rheinland Eye Comfort Certification, DCI-P3, Scratch resistant, Capacitive, Multi-touch, Frameless

Résolution: 50 Mpx; 50 Mpx
Ouverture: ƒ/ 1.8; ƒ/ 1.8
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 60 fps
Fonctions: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 64 GB; 128 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 75.1 mm 163.3 mm 8.4 mm Print 3D Model; 82.1 mm 171.1 mm 8.0 mm Print 3D Model
Poids: 188 g; 224 g
Matériaux: Plastic; Plastic
Couleurs: Black Cyan Green; Black Silver Violet
Surface utile: 84 %; 83 %
Résistance eau/poussière: —; IP64
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 13 Tiramisu Android 13; Android 16 HyperOS 3.X (Android 16)
Services Google: With Google Mobile Services; With Google Mobile Services
Mises à jour: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.1 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)