hotwav Cyber 13 Pro vs iiif150 H2022

En bref

Marque: Hotwav; iiiF150
Date de sortie: octobre 2023, il y a 2 ans et 8 mois; septembre 2021, il y a 4 ans et 9 mois
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 68.700 Antutu v8 Overall performance better than 50% of devices

Taille: 6.6"; 5.5"
Résolution: 1080 x 2408 px FHD+; 720 x 1440 px HD+
Type: LCD IPS; LCD IPS
Densité: 396 ppi High Density; 293 ppi Medium Density
Rapport d’aspect: 21:9; 18:9
Fonctions: Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch; Medium-sized Notch, LED Notifications, 2.5D curved glass screen, Corning Gorilla Glass 5, Capacitive, Multi-touch, Frameless

Chipset: Unisoc Tiger T619; MediaTek Helio A22 (MT6761)
CPU: 2 x ARM Cortex A75 2.2Ghz + 6 x ARM Cortex A55 1.8Ghz; 4x Cortex A53 2.0 GHz
Type de CPU: Octa-Core; Quad-Core
Gravure: 12 nm; 12 nm
Fréquence: 2 GHz; 2 GHz
GPU: GPU ARM Mali-G57; IMG PowerVR GE-class GPU
RAM: 12 GB; 4 GB
Type de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Résolution: 64 Mpx; 13 Mpx
Ouverture: Unknow; ƒ/ 2.0
Flash: Dual LED; Quad LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Digital image stabilization, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 32 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot

Dimensions: 84.2 mm 176.8 mm 16.8 mm Print 3D Model; 78.3 mm 157.0 mm 15.0 mm Print 3D Model
Poids: 380 g; 267 g
Matériaux: TPU , Rugged Smartphone; Rugged Smartphone, Plastic
Couleurs: Black; Black Green
Résistance eau/poussière: IP68, MIL-STD-810G , IP69; IP68, MIL-STD-810G , IP69
Résistance aux chutes: Class A B C D E 270 drops without defects; —
Réparabilité: Class A B C D E; —
Surface utile: 70 %; 63 %

Système d’exploitation: Android 13 Tiramisu Android 13; Android 11 Red Velvet Cake Android 11
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.3; Bluetooth 5.0
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), HID (Human Interface Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)