hotwav Cyber 16 Pro vs iiif150 B3C

En bref

Marque: Hotwav; iiiF150
Date de sortie: août 2025, il y a 9 mois; avril 2025, il y a 1 ans et 1 mois
AnTuTu: 401.000 Antutu v10 Overall performance better than 65% of devices; 251.000 Antutu v10 Overall performance better than 59% of devices

Taille: 6.6"; 6.6"
Résolution: 1080 x 2408 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Densité: 400 ppi Very high density; 266 ppi Medium Density
Rapport d’aspect: 20:9; 20:9
Fonctions: Hole-punch Notch, Refresh rate 120 Hz, Touch sampling rate 240 Hz, Peak brightness - 700 cd/m², Brightnes 480 cd/m² (typ), 1500:1 contrast ratio, Color LED Notifications, Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, Color LED Notifications, Corning Gorilla Glass 3, Capacitive, Multi-touch

Résolution: 108 Mpx; 50 Mpx
Ouverture: ƒ/ 1.95; Unknow
Capteur: Samsung S5KHM2; —
Taille de pixel: 0.70 µm; —
Taille du capteur: 1/1.52"; —
Flash: Dual LED; Triple LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: 4K Video, Digital zoom, Optical zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 512 GB; 256 GB
Type: UFS Storage 2.2; UFS Storage 2.2
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 85.5 mm 185.5 mm 12.8 mm Print 3D Model; 79.6 mm 168.8 mm 15.8 mm Print 3D Model
Poids: 292 g; 336 g
Matériaux: Rugged Smartphone, Corning Gorilla Glass 5; TPU , Rugged Smartphone, Polycarbonate , Metal
Couleurs: Black Gold; Black Gray
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Résistance aux chutes: Class A B C D E 84 drops without defects; Class A B C D E 270 drops without defects
Réparabilité: Class A B C D E; Class A B C D E
Surface utile: 75 %; 78 %

Système d’exploitation: Android 15 Android 15; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax) , WiFi 6E; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo, BeiDou (B1), BeiDou (B2), NavIC System; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B32 (1500), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)