hotwav T7 Pro vs lava O3

En bref

Marque: Hotwav; Lava
Date de sortie: juin 2024, il y a 1 ans et 11 mois; septembre 2024, il y a 1 ans et 8 mois
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 154.110 Antutu v10 Overall performance better than 54% of devices

Taille: 6.6"; 6.75"
Résolution: 1080 x 2460 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Densité: 407 ppi Very high density; 260 ppi Medium Density
Rapport d’aspect: 21:9; 20:9
Fonctions: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Water Drop Notch, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Spreadtrum Unisoc SC9863A
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 28 nm
Fréquence: 2 GHz; 1.6 GHz
GPU: Mali-G72 MP3; PowerVR GE8322
RAM: 6 GB; 3 GB
Type de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Résolution: 64 Mpx; 13 Mpx
Ouverture: Unknow; Unknow
Flash: LED; Dual LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 64 GB
Type: eMMC 5.1 Storage; —
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.1 mm 164.9 mm 8.8 mm Print 3D Model
Poids: 292 g; 193 g
Matériaux: Rugged Smartphone, Plastic , Faux leather; Plastic
Couleurs: Black Orange; Black White Violet
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; IP54
Résistance aux chutes: Class A B C D E 270 drops without defects; —
Réparabilité: Class A B C D E; —
Surface utile: 71 %; 87 %

Système d’exploitation: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 4.2
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B8 (900), B28b (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)