hotwav T7 Pro vs Meizu mblu 21

En bref

Marque: Hotwav; Meizu
Date de sortie: juin 2024, il y a 1 ans et 11 mois; novembre 2024, il y a 1 ans et 6 mois
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 239.300 Antutu v10 Overall performance better than 57% of devices

Taille: 6.6"; 6.79"
Résolution: 1080 x 2460 px FHD+; 720 x 1640 px HD+
Type: LCD IPS; LCD IPS
Densité: 407 ppi Very high density; 264 ppi Medium Density
Rapport d’aspect: 21:9; 20:9
Fonctions: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Unisoc Tiger T606
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 12 nm
Fréquence: 2 GHz; 1.6 GHz
GPU: Mali-G72 MP3; ARM Mali-G57
RAM: 6 GB; 4 GB
Type de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Résolution: 64 Mpx; 13 Mpx
Ouverture: Unknow; Unknow
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Taille de pixel: —; 0.80 µm

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 78.0 mm 170.8 mm 9.4 mm Print 3D Model
Poids: 292 g; 196 g
Matériaux: Rugged Smartphone, Plastic , Faux leather; Plastic
Couleurs: Black Orange; Black White Blue
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; —
Résistance aux chutes: Class A B C D E 270 drops without defects; —
Réparabilité: Class A B C D E; —
Surface utile: 71 %; 82 %

Système d’exploitation: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; —
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B5 (850)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850)