hotwav T7 Pro vs Samsung Galaxy F04

En bref

Marque: Hotwav; Samsung
Date de sortie: juin 2024, il y a 2 ans; janvier 2023, il y a 3 ans et 5 mois
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 121.534 Antutu v9 Overall performance better than 53% of devices

Taille: 6.6"; 6.5"
Résolution: 1080 x 2460 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Densité: 407 ppi Very high density; 270 ppi Medium Density
Rapport d’aspect: 21:9; 20:9
Fonctions: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Water Drop Notch, Capacitive, Multi-touch, Infinity-V

Chipset: MediaTek MT8788V; MediaTek Helio P35 MT6765
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x Cortex A53 2.3 GHz + 4x Cortex A53 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 14 nm
Fréquence: 2 GHz; 2.3 GHz
GPU: Mali-G72 MP3; PowerVR GE8320
RAM: 6 GB; 4 GB
Type de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Résolution: 64 Mpx; 13 Mpx
Ouverture: Unknow; ƒ/ 2.2
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, Scene mode, Self-timer

Capacité: 256 GB; 64 GB
Type: eMMC 5.1 Storage; —
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 75.9 mm 164.2 mm 9.1 mm Print 3D Model
Poids: 292 g; 188 g
Matériaux: Rugged Smartphone, Plastic , Faux leather; Plastic
Couleurs: Black Orange; Purple Green
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; —
Résistance aux chutes: Class A B C D E 270 drops without defects; —
Réparabilité: Class A B C D E; —
Surface utile: 71 %; 81 %

Système d’exploitation: Android 13 Tiramisu Android 13; Android 12 Snow Cone Android 12
Services Google: With Google Mobile Services; With Google Mobile Services
Mises à jour: —; OS updates: 2 years, Security updates: 4 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B3 (1800), B5 (850), B8 (900)