hotwav T7 Pro vs Xiaomi Redmi 10C

En bref

Marque: Hotwav; Xiaomi
Date de sortie: juin 2024, il y a 2 ans; mars 2022, il y a 4 ans et 3 mois
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 248.639 Antutu v9 Overall performance better than 58% of devices

Taille: 6.6"; 6.71"
Résolution: 1080 x 2460 px FHD+; 720 x 1650 px HD+
Type: LCD IPS; LCD IPS
Densité: 407 ppi Very high density; 268 ppi Medium Density
Rapport d’aspect: 21:9; 20:9
Fonctions: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Water Drop Notch, Scratch resistant, Corning Gorilla Glass, 2.5D glass screen, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Qualcomm Snapdragon 680 (SM6225)
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x2.4 GHz Kryo 265 Gold + 4x1.9GHz Kryo 265 Silver
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 6 nm
Fréquence: 2 GHz; 2.4 GHz
GPU: Mali-G72 MP3; Adreno 610
RAM: 6 GB; 4 GB
Type de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Résolution: 64 Mpx; 50 Mpx
Ouverture: Unknow; ƒ/ 1.8
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Capteur: —; Samsung S5KJN1
Taille de pixel: —; 0.64 µm
Taille du capteur: —; 1/2.76"

Capacité: 256 GB; 64 GB
Type: eMMC 5.1 Storage; UFS Storage 2.2
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.6 mm 169.6 mm 8.3 mm Print 3D Model
Poids: 292 g; 190 g
Matériaux: Rugged Smartphone, Plastic , Faux leather; Plastic
Couleurs: Black Orange; Blue Gray Green
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; —
Résistance aux chutes: Class A B C D E 270 drops without defects; —
Réparabilité: Class A B C D E; —
Surface utile: 71 %; 83 %

Système d’exploitation: Android 13 Tiramisu Android 13; Android 11 Red Velvet Cake MIUI V13 (Android 11)
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)