hotwav T7 vs hotwav T7 Pro

En bref

Marque: Hotwav; Hotwav
Date de sortie: July 2024, 1 year ago; June 2024, 1 year ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Taille: 6.6"; 6.6"
Résolution: 1080 x 2460 px FHD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Densité: 407 ppi Very high density; 407 ppi Very high density
Rapport d’aspect: 21:9; 21:9
Fonctions: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek MT8788V; MediaTek MT8788V
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 12 nm
Fréquence: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Mali-G72 MP3
RAM: 4 GB; 6 GB
Type de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Résolution: 21 Mpx; 64 Mpx
Ouverture: Unknow; Unknow
Capteur: Sony Exmor; —
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 128 GB; 256 GB
Type: eMMC 5.1 Storage; eMMC 5.1 Storage
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Poids: 292 g; 292 g
Matériaux: Rugged Smartphone, Plastic , Faux leather; Rugged Smartphone, Plastic , Faux leather
Couleurs: Black Orange; Black Orange
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Surface utile: 71 %; 71 %
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)