hotwav T7 vs Xiaomi Redmi 13

En bref

Marque: Hotwav; Xiaomi
Date de sortie: juillet 2024, il y a 1 ans et 10 mois; mai 2024, il y a 2 ans
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Taille: 6.6"; 6.79"
Résolution: 1080 x 2460 px FHD+; 1080 x 2400 px FHD+
Type: LCD IPS; LTPS LCD
Densité: 407 ppi Very high density; 388 ppi High Density
Rapport d’aspect: 21:9; 19.5:9
Fonctions: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; MediaTek Helio G91
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 12 nm
Fréquence: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Arm Mali-G52 MC2 850MHz
RAM: 4 GB; 6 GB
Type de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Résolution: 21 Mpx; 108 Mpx
Ouverture: Unknow; ƒ/ 1.8
Capteur: Sony Exmor; —
Flash: LED; Quad LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 128 GB; 128 GB
Type: eMMC 5.1 Storage; eMMC 5.1 Storage
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.3 mm 168.6 mm 8.2 mm Print 3D Model
Poids: 292 g; 198 g
Matériaux: Rugged Smartphone, Plastic , Faux leather; Plastic , P2i Nano coating , Splash resistant design
Couleurs: Black Orange; Black Pink Cyan
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; —
Surface utile: 71 %; 94 %

Système d’exploitation: Android 13 Tiramisu Android 13; Android 14 Upside-down cake HyperOS (Android 14)
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.4 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)