hotwav T7S vs Tecno Spark 40

En bref

Marque: Hotwav; Tecno
Date de sortie: janvier 2025, il y a 1 ans et 5 mois; juillet 2025, il y a 11 mois
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 250.000 Antutu v10 Overall performance better than 59% of devices

Taille: 6.52"; 6.67"
Résolution: 1080 x 2460 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Densité: 407 ppi Very high density; 263 ppi Medium Density
Rapport d’aspect: 21:9; 20:9
Fonctions: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 120 Hz, Scratch resistant, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; MediaTek Helio G91
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 12 nm
Fréquence: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Arm Mali-G52 MC2 850MHz
RAM: 4 GB; 8 GB
Type de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Résolution: 21 Mpx; 50 Mpx
Ouverture: Unknow; ƒ/ 1.8
Capteur: Sony Exmor; —
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash

Capacité: 128 GB; 128 GB
Type: eMMC 5.1 Storage; —
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 77.0 mm 165.6 mm 7.7 mm Print 3D Model
Poids: 310 g; 188 g
Matériaux: Rugged Smartphone, Plastic , Faux leather; Polycarbonate
Couleurs: Black Green; Black White Blue Gray
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; IP64
Résistance aux chutes: Class A B C D E 270 drops without defects; —
Réparabilité: Class A B C D E; —
Surface utile: 71 %; 84 %

Système d’exploitation: Android 13 Tiramisu Android 13; Android 15 Android 15
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.3
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)