hotwav W11 vs Xiaomi Redmi A3

En bref

Marque: Hotwav; Xiaomi
Date de sortie: mars 2024, il y a 2 ans et 3 mois; février 2024, il y a 2 ans et 4 mois
AnTuTu: 260.000 Antutu v10 Overall performance better than 60% of devices; 127.000 Antutu v9 Overall performance better than 53% of devices

Taille: 6.6"; 6.7"
Résolution: 1080 x 2460 px FHD+; 720 x 1650 px HD+
Type: LCD IPS; LCD IPS
Densité: 407 ppi Very high density; 269 ppi Medium Density
Rapport d’aspect: 20:9; 20:9
Fonctions: Hole-punch Notch, Brightnes 380 cd/m² (typ), 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch; Water Drop Notch, Refresh rate 90 Hz, Brightnes 500 cd/m² (typ), DC dimming, Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch, Frameless

Résolution: 64 Mpx; 8 Mpx
Ouverture: ƒ/ 1.8; ƒ/ 2.0
Capteur: Sony IMX686 Exmor RS; —
Taille de pixel: 0.80 µm; —
Taille du capteur: 1/1.7"; —
Flash: Dual LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 64 GB
Type: UFS Storage 2.1; eMMC 5.1 Storage
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot

Dimensions: 84.8 mm 176.6 mm 26.5 mm Print 3D Model; 76.3 mm 168.3 mm 8.3 mm Print 3D Model
Poids: 563 g; 199 g
Matériaux: Rugged Smartphone, Polycarbonate; Glass , Leather
Couleurs: Gray Orange; Black Blue Green
Résistance eau/poussière: IP68, MIL-STD-810G , IP69; —
Surface utile: 70 %; 82 %

Système d’exploitation: Android 13 Tiramisu Android 13; Android 14 Upside-down cake MIUI 14 (Android 14)
Services Google: With Google Mobile Services; With Google Mobile Services
Mises à jour: —; OS updates: 2 years, Security updates: 3 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2 LELow energy consumption; Bluetooth 5.3 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Direct
USB: USB Type-C; —
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)