iiif150 B1 vs Poco M6

En bref

Marque: iiiF150; POCO
Date de sortie: août 2022, il y a 3 ans et 10 mois; juin 2024, il y a 2 ans
AnTuTu: 160.000 Antutu v10 Overall performance better than 54% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Taille: 6.5"; 6.79"
Résolution: 1080 x 2400 px FHD+; 1080 x 2460 px FHD+
Type: LCD IPS; LTPS LCD
Densité: 405 ppi Very high density; 388 ppi High Density
Rapport d’aspect: 20:9; 21:9
Fonctions: Hole-punch Notch, Corning Gorilla Glass, Capacitive, Multi-touch; Hole-punch Notch, SGS Certified, TUV Rheinland Low Blue Light, Refresh rate 90 Hz, Brightnes 450 cd/m² (typ), Max brightness HBM - 550 cd/m², TÜV Rheinland Eye Comfort Certification, DC dimming, Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Résolution: 20 Mpx; 108 Mpx
Ouverture: Unknow; ƒ/ 1.75
Flash: Triple LED; Quad LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Capteur: —; Samsung HM6
Taille de pixel: —; 0.64 µm
Taille du capteur: —; 1/1.67"

Capacité: 64 GB; 128 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 81.6 mm 171.0 mm 16.7 mm Print 3D Model; 76.3 mm 168.6 mm 8.3 mm Print 3D Model
Poids: 356 g; 205 g
Matériaux: Rugged Smartphone, Plastic , Magnesium alloy; Plastic , P2i Nano coating , Splash resistant design
Résistance eau/poussière: IP68, MIL-STD-810G , IP69; —
Surface utile: 73 %; 94 %
Couleurs: —; Black Silver Violet

Système d’exploitation: Android 12 Snow Cone Android 12; Android 14 Upside-down cake HyperOS (Android 14)
Services Google: With Google Mobile Services; With Google Mobile Services
Mises à jour: —; OS updates: 2 years, Security updates: 2 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.4 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)